Manufacturing

Stora Enso and NXP join forces to develop 'smart packaging'

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Sam Curtis

Written on 27/07/2015 | Posted 2 years 6 months 23 days ago

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The innovation facility will be based at Stora Enso's head office in Helsinki The innovation facility will be based at Stora Enso's head office in Helsinki

Stora Enso has partnered with NXP to develop 'intelligent' packaging products that incorporate RFID (Radio frequency identification).

By using NXP RFID technology, Stora Enso will be able to produce smart packages that can be easily tracked, traced and examined to detect if a delivery has been tampered with. When received by the customer, the use of an NFC-enabled smartphone could provide additional information about the delivery service. An innovation centre will open in Helsinki later this year where the developments will take place.

“Our RFID technology in combination with Stora Enso's packaging solutions creates additional value to both consumers and brand owners by providing information and insights along the complete supply chain," comments Ruediger Stroh, executive vice-president and general manager for Security and Connectivity at NXP Semiconductors.

“The ability of the RFID tag to detect when a package has been compromised and also provide additional product information via NFC truly enables a unique, smart, engaging brand experience and is another example of how security can be broadly implemented to protect our everyday lives.”

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